Santa Clara -
March 28, 2008 -
SILEGO Technology announces a new LGA (Land Grid Array) package for
notebook clocks, improving signal integrity, yield, cost, and
reliability. LGA is a proven and widely available package
technology. The LGA package is based on substrate design which is
6/6 RoHS compliant and halogen Free. The LGA package extends the
Silego package roadmap for package size reduction and ultra mobile
applications.
Silego
LGA Package Presentation
Silego
LGA Package Manual Soldering Instructions
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